ITEM |
Technical Capablity |
Quality Control Standard |
IPC-A-600G, IPC-TM-650, IPC-6012 class II/III. |
| Electronic Test Method | Flyprobe / Test Fixture |
| Software Support | Genisis, CAM350, Altium, Protel 99SE, Eagle. |
| Material | FR4, FR4 High TG, Aluminum-Core, Bergquist, Rogers, Halogen Free, PTFE. |
| Layer Count | 1 - 30 layer |
| Max. Board Size | 600 x 1000mm (2 layer) 600 x 900mm (≤6 layer) 500 x 600mm (≥8 layer) |
| Profile Tolerance | ± 0.10mm / ± 0.13mm |
| Board Thickness | 0.2 - 6.0 mm |
| Copper Thickness | 1-6 oz |
| Aspect Ratio | 13 : 1 |
| Min. Finished Hole Size | 0.15 mm |
| Hole Tolerance | NPTH ± 0.05 mm / PTH ± 0.075 mm |
| Min. Hole to Hole Space | 0.15 mm |
| Min. Hole to Trace Space | 0.15 mm |
| Min. Copper to Edge Space | 0.20 mm |
| Min. Ring Pad | 0.10 mm |
| Min. Blind/Buried Via | 0.15 mm |
| Min. Trace Width/Space | 3/3 mil |
| Layer Position Tolerance | ≤ 2.5 mil |
| Impedance Control | ± 10% |
| Soldermask / Overlay Color | Green, Black, White, Red, Blue, Purple, Yellow. |
| Surface Treatment | HASL RoHS, Immersion Tin/Gold 4u"/Silver, Hard Gold 50u", OSP. |
| Others | Plugged Via, Peters Peelable Soldermask, 3M High Temperature Tape, etc. |